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Production Process

Production Process

Production Process

Production Process
  • Technical AnalysisCAM engineers analyse Gerber files and PCB specifications provided by you and enter all product specifications into the ERP system, which are later used by both commercial and technical departments.
  • Quotation and Order ConfirmationCustomer representatives determine the quote according to technical specifications and your requested delivery date. Production begins following the order confirmation.
  • Production PlanningAt this stage, Gerber files are processed according to PCB production parameters and efficiency. CNC, LDI, and AOI test files are generated and laser production films are plotted. Technical questions are raised here in case there is any conflict.
  • Production Panel Design (CCL Cutting)CCL (Copper Clad Laminate) is cut down into the production panel size defined on the work order form, and the edges of the panel will be bewelled for smooth handling.
  • Inner Layer PreperationInner layers are chosen according to stack-up information provided and the layout is created on an inner layer. This process is repeated based on the stack-up structure.
  • Multilayer BondingBased on the stack-up information, inner layers, prepregs, and copper foils are bonded in a multilayer hot press with suitable pressing parameters for the chosen material.
  • CNC DrillingProduction panels are drilled at high speed drilling machines with laser drill diameter check units. The boards are cleaned from remaining burrs and dust before the next stage.
  • PTH (Plating Through Hole)The holes are plated with graphite, following the ultrasonic conditioning and chemical activation processes.
  • Electrolytic Copper PlatingActivated holes and the surface of the PCB are electroplated with 25 μm copper to provide the connection between layers.
  • ImagingAfter chemical cleaning, the boards are covered with photosensitive etch resist dry films in dust-free rooms and the image is transferred by the acid-etching method.
  • AOI (Automatic Optical Inspection)The image transferred to the production panel is scanned by high-resolution optical cameras and compared with the working Gerber files.
  • SoldermaskAt this stage, soldermask will be applied in dustfree rooms by leaving solderable areas open. Soldermask will be applied by 3 different curing methods as Photoimagable, Thermal and UV methods.
  • Component LegendComponent legend is printed either by the screen printing method or with inkjet printers.
  • Surface FinishingSurface finishing types such as LF HASL, OSP, and ENIG are applied to provide easy solderability and protect solderable areas from oxidation.
  • CNC Outline Profiling – V-Cut Scoring- PunchingThe pcb production panel will be re-sized to customer panel and customer panel will be prepared for depanelization by either routing (milling), v-cut scoring or pressing processes.
  • Final CleaningResidues that remained from the production are cleaned with high-pressure DI water in ultrasonic cleaning machines.
  • Electrical TestAll boards that are produced must go through either fixture or flying probe testings.
  • Visual Inspection and ReportingFinal quality control is completed by our experienced operators with IPC certifications. CoC (Certificate of Conformity), Outgoing Inspection Report, PPAP, Micro-Section, and Special Dimension Reports are available upon request.
  • Packing and DeliveryThe boards are vacuum-packed with humidity indicators and silica gel to achieve the maximum shelf life. Unique labels are available upon request.